After the packaging process of integrated circuit (IC) chips, they must be strictly tested to ensure the quality of products. Chip appearance inspection is an essential and important link, which directly affects the quality of IC products and the smooth progress of subsequent production links.
There are three methods for appearance inspection:
First, the traditional manual inspection method mainly relies on visual inspection and manual inspection, which is not reliable, low detection efficiency, high labor intensity, and detection defects, which cannot adapt to mass production and manufacturing;
The second is the detection method based on laser measurement technology, which requires high hardware requirements, high cost, high equipment failure rate and difficult maintenance;
The third is the detection method based on machine vision. Because the hardware of the detection system is easy to integrate and realize, the detection speed is fast, the detection accuracy is high, and the use and maintenance are relatively simple, this method is more and more widely used in the field of chip appearance detection, which is a development trend of IC chip appearance detection.
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